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Part Number TC74HC240F described as Microcircuit Digital with NSN 5962-01-466-8926 with FSC 5962 Microcircuits Electronic by Manufacture Toshiba Corp is available in stock. We provide comprehensive database of aerospace and aviation components, sub-assemblies, and completed assemblies allows us to respond to your RFQ within 15 minutes.
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| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-466-8926 Item Description: Microcircuit Digital | 5962 | 014668926 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 74hc240f | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| AEHX | MAXIMUM POWER DISSIPATION RATING | 180.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -40.0/+85.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| AGAV | END ITEM IDENTIFICATION | GENERAL PURPOSE ELECTRONIC TEST EQUIPMENT/END ITEM IS 6625-01-425-2551 ANALYER, SPECTRUM" |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HIGH SPEED AND 3-STATE OUTPUT" |
| CQSJ | INCLOSURE MATERIAL | PLASTIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 BUFFER, INVERTING" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | OCTAL BUS BUFFER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 GULLWING" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 180.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -40.0/+85.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| AGAV | END ITEM IDENTIFICATION | GENERAL PURPOSE ELECTRONIC TEST EQUIPMENT/END ITEM IS 6625-01-425-2551 ANALYER, SPECTRUM" |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HIGH SPEED AND 3-STATE OUTPUT" |
| CQSJ | INCLOSURE MATERIAL | PLASTIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 BUFFER, INVERTING" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | OCTAL BUS BUFFER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT" |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 GULLWING" |
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