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Part Number TIBPAL20R8-20MWB described as Microcircuit Memory with NSN 5962-01-479-8350 with FSC 5962 Microcircuits Electronic by Manufacture Texas Instruments Deutschland Gmbh is available in stock. We provide comprehensive database of aerospace and aviation components, sub-assemblies, and completed assemblies allows us to respond to your RFQ within 15 minutes.
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| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-479-8350 Item Description: Microcircuit Memory | 5962 | 014798350 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Tibpal20r8-20mwb | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.640 INCHES NOMINAL" |
| ADAT | BODY WIDTH | 0.420 INCHES NOMINAL" |
| ADAU | BODY HEIGHT | 0.090 INCHES NOMINAL" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| AGAV | END ITEM IDENTIFICATION | F-15-APPLICATIONS" |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND ELECTROSTATIC SENSITIVE AND SCHOTTKY AND LOW POWER AND HIGH PERFORMANCE AND 3-STATE OUTPUT" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS" |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUITS, DIGITAL, BIPOLAR, PROGRAMMABLE LOGIC, MONOLITHIC SILICON" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 12.0 VOLTS MAXIMUM INPUT" |
| CZER | MEMORY DEVICE TYPE | PAL" |
| FEAT | SPECIAL FEATURES | GENERIC P/N PAL20R8A" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 LEADLESS" |
| ADAQ | BODY LENGTH | 0.640 INCHES NOMINAL" |
| ADAT | BODY WIDTH | 0.420 INCHES NOMINAL" |
| ADAU | BODY HEIGHT | 0.090 INCHES NOMINAL" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| AGAV | END ITEM IDENTIFICATION | F-15-APPLICATIONS" |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND ELECTROSTATIC SENSITIVE AND SCHOTTKY AND LOW POWER AND HIGH PERFORMANCE AND 3-STATE OUTPUT" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS" |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUITS, DIGITAL, BIPOLAR, PROGRAMMABLE LOGIC, MONOLITHIC SILICON" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 12.0 VOLTS MAXIMUM INPUT" |
| CZER | MEMORY DEVICE TYPE | PAL" |
| FEAT | SPECIAL FEATURES | GENERIC P/N PAL20R8A" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 LEADLESS" |
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