Part Number SMJ416400-10FNC described as Microcircuit Memory with NSN 5962-01-463-6609 with FSC 5962 Microcircuits Electronic by Manufacture Texas Instruments Deutschland Gmbh is available in stock. We provide comprehensive database of aerospace and aviation components, sub-assemblies, and completed assemblies allows us to respond to your RFQ within 15 minutes.
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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-463-6609 Item Description: Microcircuit Memory | 5962 | 014636609 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
5962-92312 | 5 | 1 | 4 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.765 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.440 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.105 INCHES MINIMUM AND 0.125 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | RSIP, CAGE 67268 |
CBBL | FEATURES PROVIDED | MONOLITHIC |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, MEMORY, DIGITAL, CMOS 4MEG X 4 DRAM, MONOLITHIC SILICON |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.0 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT |
CZEQ | TIME RATING PER CHACTERISTIC | 100.00 NANOSECONDS NOMINAL ACCESS |
CZER | MEMORY DEVICE TYPE | RAM |
FEAT | SPECIAL FEATURES | RECOMMENDED OPERATING SUPPLY (VCC) 4.5 TO 5.5 VDC |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 24 LEADLESS |
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