Solid State Testing Inc Part Number HM465162 - Get an Instant Quote

Part Number:  HM465162
Manufacturer:  solid state testing inc
NIIN:  01-349-0265
Item Name :  microcircuit memory
CAGE Code:  9N185
INC Code:  41015
Country:  USA
NCB Code:  01
Last Updated:  05-22-2025

Part Number HM465162 described as Microcircuit Memory with NSN 5962-01-349-0265 with FSC 5962 Microcircuits Electronic by Manufacture Solid State Testing Inc is available in stock. We provide comprehensive database of aerospace and aviation components, sub-assemblies, and completed assemblies allows us to respond to your RFQ within 15 minutes.

Simplified Purchasing is owned and operated by ASAP Semiconductor, an industry-leading AS9120B, ISO 9001:2015, and FAA AC 0056B certified distributor of Solid State Testing Inc aerospace and aviation parts like HM465162. We are a service-oriented company that provides quality NSN components with an emphasis on United States export law through our delivery centers at 2 strategic locations, California and Nevada. 

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Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/customer-terms-and-conditions/ . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.

NSN Information for Part Number HM465162 with NSN 5962-01-349-0265, 5962013490265

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5962-01-349-0265

Item Description:

Microcircuit Memory

59620134902650NB
CIICHCCESDPMICCriticalityENAC
UBA0
Part NumberISCRNVCRNCCHCCMSDSSADC
Hm465162515

Characteristics Data of NSN 5962-01-349-0265, 5962013490265

MRCCriteriaCharacteristic
ADAQBODY LENGTH0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM
CQZPINPUT CIRCUIT PATTERN22 INPUT
TESTTEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC. .
ABMKOVERALL WIDTH0.508 INCHES MAXIMUM
ADATBODY WIDTH0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM
ADAUBODY HEIGHT0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM
AFGAOPERATING TEMP RANGE-55.0 TO 125.0 DEG CELSIUS
CQSJINCLOSURE MATERIALCERAMIC
CQSZINCLOSURE CONFIGURATIONLEADED CHIP CARRIER
CTQXCURRENT RATING PER CHARACTERISTIC70.00 MILLIAMPERES MAXIMUM SUPPLY
CWSGTERMINAL SURFACE TREATMENTSOLDER
CZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC5.5 VOLTS MAXIMUM POWER SOURCE
CZEQTIME RATING PER CHACTERISTIC90.00 NANOSECONDS MAXIMUM ACCESS
CZERMEMORY DEVICE TYPERAM
TTQYTERMINAL TYPE AND QUANTITY32 J-HOOK
ABHPOVERALL LENGTH0.610 INCHES MAXIMUM
ABKWOVERALL HEIGHT0.185 INCHES NOMINAL
AFJQSTORAGE TEMP RANGE-55.0 TO 150.0 DEG CELSIUS
CBBLFEATURES PROVIDEDELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION
CQWXOUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
CZEPCAPITANCE RATING PER CHARACTERISTIC10.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM
AEHXMAXIMUM POWER DISSIPATION RATING1.0 WATTS



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