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Part Number RB82S091I883B described as Microcircuit Memory with NSN 5962-01-226-2279 with FSC 5962 Microcircuits Electronic by Manufacture Philips Semiconductors Inc is available in stock. We provide comprehensive database of aerospace and aviation components, sub-assemblies, and completed assemblies allows us to respond to your RFQ within 15 minutes.
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| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-226-2279 Item Description: Microcircuit Memory | 5962 | 012262279 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 911732-1 | 3 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.380 INCHES MINIMUM AND 1.430 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.120 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1000.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0- 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0- 150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | AN-BPS14TO15E |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND W-ENABLE AND MONOLITHIC AND BURN IN |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC. . |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
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