Mmi Amd Part Number PAL16R8B-2MW 883B - Get an Instant Quote

Part Number:  PAL16R8B-2MW 883B
Alternate P/N:  PAL16R8B2MW883B
Manufacturer:  mmi amd
NIIN:  01-332-5751
Item Name :  microcircuit memory
CAGE Code:  50364
INC Code:  41015
Country:  USA
NCB Code:  01
Last Updated:  05-21-2025

Part Number PAL16R8B-2MW 883B described as Microcircuit Memory with NSN 5962-01-332-5751 with FSC 5962 Microcircuits Electronic by Manufacture Mmi Amd is available in stock. We provide comprehensive database of aerospace and aviation components, sub-assemblies, and completed assemblies allows us to respond to your RFQ within 15 minutes.

Simplified Purchasing is owned and operated by ASAP Semiconductor, an industry-leading AS9120B, ISO 9001:2015, and FAA AC 0056B certified distributor of Mmi Amd aerospace and aviation parts like PAL16R8B-2MW 883B. We are a service-oriented company that provides quality NSN components with an emphasis on United States export law through our delivery centers at 2 strategic locations, California and Nevada. 

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Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/customer-terms-and-conditions/ . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.

NSN Information for Part Number PAL16R8B-2MW 883B with NSN 5962-01-332-5751, 5962013325751

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5962-01-332-5751

Item Description:

Microcircuit Memory

59620133257510ND
CIICHCCESDPMICCriticalityENAC
UDA0
Part NumberISCRNVCRNCCHCCMSDSSADC
5962-85155514

Characteristics Data of NSN 5962-01-332-5751, 5962013325751

MRCCriteriaCharacteristic
ADAQBODY LENGTH0.540 INCHES MAXIMUM
ADATBODY WIDTH0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM
AEHXMAXIMUM POWER DISSIPATION RATING0.6 WATTS
AFGAOPERATING TEMP RANGE-55.0- 125.0 DEG CELSIUS
AFJQSTORAGE TEMP RANGE-65.0- 150.0 DEG CELSIUS
CBBLFEATURES PROVIDEDBIPOLAR AND MONOLITHIC AND PROGRAMMABLE AND W-CLOCK AND 3-STATE OUTPUT AND W-ENABLE
CQWXOUTPUT LOGIC FORMBIPOLAR METAL-OXIDE SEMICONDUCTOR
CZEQTIME RATING PER CHACTERISTIC20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME HIGH TO LOW LEVEL OUTPUT
TESTTEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC. .
ADAUBODY HEIGHT0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM
CTFTCASE OUTLINE SOURCE AND DESIGNATORF-9 MIL-M-38510
CTQXCURRENT RATING PER CHARACTERISTIC12.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE
CQSJINCLOSURE MATERIALCERAMIC
ABMKOVERALL WIDTH0.745 INCHES MINIMUM AND 1.040 INCHES MAXIMUM
CQSZINCLOSURE CONFIGURATIONFLAT PACK
CQZPINPUT CIRCUIT PATTERN16 INPUT
CWSGTERMINAL SURFACE TREATMENTSOLDER
CZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
CZERMEMORY DEVICE TYPEPAL
TTQYTERMINAL TYPE AND QUANTITY20 FLAT LEADS



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