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Part Number PAL16R8BML 883B described as Microcircuit Memory with NSN 5962-01-262-2712 with FSC 5962 Microcircuits Electronic by Manufacture Mmi Amd is available in stock. We provide comprehensive database of aerospace and aviation components, sub-assemblies, and completed assemblies allows us to respond to your RFQ within 15 minutes.
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| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-262-2712 Item Description: Microcircuit Memory | 5962 | 012622712 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 5962-85155022bb | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.350 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.350 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.1 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0- 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0- 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND BIPOLAR AND PROGRAMMABLE |
| CQSJ | INCLOSURE MATERIAL | METAL OR PLASTIC OR CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC. . |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PIN |
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